South Korean Researchers Develop Flawless Ultrathin Semiconductors for Advanced Multi-Layer Chip Fabrication

Building Atomic-Layered Skyscrapers

According to НВ — Техно: Scientists from South Korea have pioneered a technique for manufacturing multi-layered chips. Researchers at the Korea Advanced Institute of Science and Technology (KAIST) have made a major breakthrough in growing defect-free ultrathin semiconductors, paving the way for stacking computing units and memory vertically. This innovation shortens data transmission paths and significantly boosts chip performance.

Innovative Chip Growth Technique

The team focused on growing molybdenum disulfide (MoS₂) films only a few atoms thick. In tests conducted across 400 designated sites, they achieved an impressive success rate-over 99% of the time, a single flawless crystal formed precisely at the center of each site. This novel approach was named EF-SCN.

The process involves surrounding each growth site with an oxide barrier, such as hafnium oxide, which releases oxygen. The oxygen prevents crystal nucleation near the edges, ensuring growth occurs solely in the center. Additionally, the researchers mastered selective metal deposition, enhancing precision and efficiency. For example, on samples containing molybdenum diselenide (MoSe₂), ruthenium metal deposited exclusively on the MoSe₂ regions.

This method enables semiconductors to be grown directly on chips, eliminating the need for separate fabrication and transfer steps. While a fully functional multi-layer processor has yet to be created and its speed or energy efficiency remain untested, this research was carried out in collaboration with Ulsan National Institute of Science and Technology (UNIST), Hanyang University, and TDS Innovation. The findings were published in the journal Nature, with the article released on October 14 at 5:31 PM.

This technological advance could profoundly influence the future of electronics and computing. Reducing chip size while improving their efficiency has the potential to yield more powerful and energy-saving devices, spanning from smartphones to supercomputers. Nonetheless, further research is necessary to fully harness the capabilities of this promising manufacturing technique.

This breakthrough in ultrathin semiconductors not only enhances chip performance but also sets the stage for further advancements in microchip technology. For instance, researchers at the California Institute of Technology have recently unveiled a microchip capable of redirecting light in an astonishing 74 femtoseconds, showcasing the rapid evolution of semiconductor applications. To learn more about this innovative development, visit the latest advancements in microchip technology.